Component-to-System Level Packaging Workshop –
Addressing Integration Challenges for Automotive and Industrial Applications
July 2-3, 2025
Mercure Hotel MOA Berlin, Stephanstraße 41, 10559 Berlin, Germany
An IPC Technology Solutions Workshop supported by Research Fab Microelectronics Germany (FMD) with focus on APECS Pilot Line
The road to autonomous driving and the need for more electrified mobility have resulted in sizable changes for electronics such as semiconductors and batteries used in automotive applications. Smart homes and infrastructure, factory automation and preventive maintenance have driven significant advancements in industrial electronics too.
These applications demand significant system miniaturization through complex chiplet concepts and heterogenous integration solutions for processors, memories, power management along with sensors and MEMS, wireless and optical connectivity and other advanced communication components and systems.
Though assembly levels 0 and 1, with chip-package interaction challenges addressed, packaged device/components formation is enabled. Assembly levels 2 and 3 (board and system assembly) are indispensable from system level integration and final product/system performance points of view. With heterogenous integration solutions and miniaturization, the board as we know it today is partially moving inside the package, and System-in-Package (SiP) is created.
Advancements in compute and storage for automotive applications, sensor technologies with mmWave Radar, LIDAR, and other sensing techniques along with integrated power systems for EV with high voltage, high power components and modules are bringing new challenges to both, Component-Level Packaging (CLP) and Board/System-Level-Packaging (SLP). Power delivery, thermal management, assembly and reliability at component/system level demand innovative design approaches, materials and assembly processes for high reliability automotive and industrial requirements.
BE PART OF THE SOLUTION
The workshop is intended to bring together industry experts presenting and discussing CLP and SLP trends, requirements, challenges, solutions and the needs for guidelines/ standards desired for design, assembly, test, reliability and manufacturing from components (OSAT) and electronic manufacturing solutions (EMS) perspective.
Registration
SPONSORSHIP PACKAGES
ALL Sponsors’ Benefits:
- Promotion of your company as supporter of the workshop BEFORE the event: Logo and link to company website on the event website, the event flyer and brochure sent out in Mailings (size and positioning according to sponsorship level)
- Promotion of your company as supporter of the workshop DURING the event: Logo visibility during the workshop, the networking breaks and social event/ networking dinner ("Thanks to our Sponsors" Roll-up, mentioning in "Welcome Presentation", slide show during the breaks, table tents during coffee- and lunch breaks, and during networking dinner)
For more information and sponsorship booking, please contact:
Steffen Kröhnert, IPC Advisor & Lead Consultant Europe – Advanced Packaging Technology
steffenkroehnert@ipc.org / +49 (0) 172 7201 472
AGENDA
DAY 1 – Wednesday, July 2nd, 2025
Arrival of attendees on July 1st or July 2nd in the morning.
| Meeting Room is available from 09:00 am (setup, pre-meetings, networking) | MOA 3 |
| Registration open from 10:00 am – 12:30 am | FOYER 1. OG |
| Time | Topic | Room |
|---|---|---|
| 11:00 am – 12:30 pm |
Welcome, Scope and Introduction (90’)
0-1 Welcome 10’ | MOA 3 |
| 12:30 pm – 01:30 pm | Lunch Break + Networking (60’) | MOA EAT |
| 01:30 pm – 03:30 pm |
Workshop – Part 1 / Market Needs (120’)
Sponsor-Pitches (3xP3’, 6xG2’) 20’ 1-1 OEM, IDM – Presentation 20’ | MOA 3 |
| 03:30 pm – 04:00 pm | Coffee Break + Networking (30’) | FOYER 1. OG |
| 04:00 pm – 06:00 pm |
Workshop – Part 2 / Supply Chain Offer (120’)
Sponsor-Pitches II (12xS1’) 15’ | MOA 3 |
| 06:00 pm – 07:00 pm | Free time, Transfer to Dinner Location (10’ walk) | MOA 3 |
| 07:00 pm – 10:00 pm | Social Event – Networking Dinner | TBD |
DAY 2 – Thursday, July 3rd, 2025
Arrival of attendees on July 1st or July 2nd in the morning.
| Time | Topic | Room |
|---|---|---|
| 07:30 am – 09:00 am | Morning Coffee and Snacks + Networking | FOYER 1. OG |
| 09:00 am – 10:30 am |
Workshop – Part 3 / R&D and Solutions (90’)
3-1 Welcome 10’ | MOA 3 |
| 10:30 am – 11:00 am | Coffee Break + Networking (30’) | FOYER 1. OG |
| 11:00 am – 12:30 pm |
Workshop – Part 4 / Project Proposals (90’)
4-1 ANY - Presentation 10’ | MOA 3 |
| 12:30 pm – 01:30 pm | Lunch Break + Networking | MOA EAT |
| 01:30 pm – 03:30 pm | Project Consortium Building Meeting (120’)’ | MOA 3 |
| 03:30 pm – 04:00 pm | Goodbye Coffee + Networking | FOYER 1. OG |
Media- and Event Partners
