Component-to-System Level Packaging Workshop –

Addressing Integration Challenges for Automotive and Industrial Applications

July 2-3, 2025

Mercure Hotel MOA Berlin, Stephanstraße 41, 10559 Berlin, Germany

Announcing Confirmed Speakers from Following Companies

An IPC Technology Solutions Workshop supported by Research Fab Microelectronics Germany (FMD) with focus on APECS Pilot Line

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The road to autonomous driving and the need for more electrified mobility have resulted in sizable changes for electronics such as semiconductors and batteries used in automotive applications.  Smart homes and infrastructure, factory automation and preventive maintenance have driven significant advancements in industrial electronics too.

These applications demand significant system miniaturization through complex chiplet concepts and heterogenous integration solutions for processors, memories, power management along with sensors and MEMS, wireless and optical connectivity and other advanced communication components and systems.

Though assembly levels 0 and 1, with chip-package interaction challenges addressed, packaged device/components formation is enabled. Assembly levels 2 and 3 (board and system assembly) are indispensable from system level integration and final product/system performance points of view. With heterogenous integration solutions and miniaturization, the board as we know it today is partially moving inside the package, and System-in-Package (SiP) is created.

Advancements in compute and storage for automotive applications, sensor technologies with mmWave Radar, LIDAR, and other sensing techniques along with integrated power systems for EV with high voltage, high power components and modules are bringing new challenges to both, Component-Level Packaging (CLP) and Board/System-Level-Packaging (SLP). Power delivery, thermal management, assembly and reliability at component/system level demand innovative design approaches, materials and assembly processes for high reliability automotive and industrial requirements.

BE PART OF THE SOLUTION

The workshop is intended to bring together industry experts presenting and discussing CLP and SLP trends, requirements, challenges, solutions and the needs for guidelines/ standards desired for design, assembly, test, reliability and manufacturing from components (OSAT) and electronic manufacturing solutions (EMS) perspective.

Registration

Accomondation

For hotel room booking, we have reserved a room contingent at the workshop venue, Mercure Hotel MOA Berlin. Please use the following link to book your hotel room at special room rates: https://moa.de/abk/ipc-electronics-europe-gmbh/

PLATINUM SPONSOR

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GOLD SPONSOR

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SILVER SPONSORS

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SPONSORSHIP PACKAGES

ALL Sponsors’ Benefits:
  • Promotion of your company as supporter of the workshop BEFORE the event: Logo and link to company website on the event website, the event flyer and brochure sent out in Mailings (size and positioning according to sponsorship level)
  • Promotion of your company as supporter of the workshop DURING the event: Logo visibility during the workshop, the networking breaks and social event/ networking dinner ("Thanks to our Sponsors" Roll-up, mentioning in "Welcome Presentation", slide show during the breaks, table tents during coffee- and lunch breaks, and during networking dinner)
Limited to 3

PLATINUM

  • Opportunity to distribute marketing material and branded gadgets
  • Opportunity to place roll-up (self-delivered) on stage in the meeting room
  • Sponsor Pitch (no slides) during the workshop: 3 min
  • 2 free workshop tickets (registration codes will be sent to you) worth €500 (incl. tax)
  • 2 free networking dinner tickets (registration codes will be sent to you) worth €100 (incl. tax)

Price: €3.000 (incl. tax)

Book now
Limited to 6

GOLD

  • Sponsor Pitch (no slides) during the workshop: 2 min
  • 1 free workshop tickets (registration code will be sent to you) worth €250 (incl. tax)
  • 1 free networking dinner tickets (registration code will be sent to you) worth €50 (incl. tax)

Price: €2.000 (incl. tax)

      Book now
      Limited to 12

      SILVER

      • Sponsor Pitch (no slides) during the workshop: 1 min

      Price: €1.000 (incl. tax)

          Book now

          For more information and sponsorship booking, please contact:
          Steffen Kröhnert, IPC Advisor & Lead Consultant Europe – Advanced Packaging Technology

          steffenkroehnert@ipc.org  /  +49 (0) 172 7201 472

          Download Speaker Companies Announcement

          AGENDA

          DAY 1 – Wednesday, July 2nd, 2025

          “Problem-Statement-Day”

          Arrival of attendees on July 1st or July 2nd in the morning until noon.

          Mercure MOA

          Meeting Room is available from 09:00 am (setup, pre-meetings, networking)

          MOA 3

          Registration open from 09:30 am – 1:30 pm

          FOYER 1. OG

          11:30 am – 01:00 pm Standing Lunch + Networking

          MOA 1-2
          FOYER 1. OG
          Time Topic Room
          01:00 pm –
          02:00 pm

          Welcome, Scope and Introduction

          “Welcome and Workshop-Scope”
          Matt Kelly, CTO, VP Standards & Technology, IPC

          “Workshop Intent and Expectations”
          Steffen Kröhnert, Advisor Advanced Packaging Technology, IPC

          “Introduction and Overview of Organizer: IPC”
          Devan Iyer, Chief Strategist, Advanced Packaging, IPC

          “Introduction and Overview of Organizer Supporter: FMD”
          Stephan Guttowski, Head of Research Fab Microelectronics Germany (FMD)

          		 MOA 3
          02:00 pm –
          03:30 pm

          WS-Part 1: Market Needs and Challenges

          “Advanced Packaging in Automotive Electronics”
          Andreas Grassmann, VP Package and Module Innovation, Infineon

          “Future Directions in Automotive Electronics: Challenges and Opportunities of Chiplet Technology“
          Pekka Sipilä, Head of Advanced Electronics Technologies, Continental

          “Challenges in heterogeneous integration for analog and mixed signal devices“
          Rajesh Mandamparambil, Technical Director, NXP Semiconductors

          “Integration Challenges in Reliably Storing and Protecting Data in Industrial, Security and IoT Applications”
          Torsten Grawunder, Senior System Designer and System Architect, Swissbit Germany AG

          		 MOA 3
          03:30 pm –
          04:00 pm          		 Coffee Break + Networking MOA 1-2
          FOYER 1. OG
          04:00 pm –
          05:10 pm

          WS-Part 2: Supply Chain Perspective

          Sponsor-Pitches
          ASE; Indium; AT&S, Koh Young Europe, Resonac

          “Designing Advanced Heterogeneous Packages: Shifting left for analyzing power delivery early on“
          Heiko Dudek, Business Development, Siemens Digital Industries Software / EDA

          “Undermining the walls on the road to more advanced semiconductor technologies by novel IC substrate technologies”
          Hannes Voraberger, Vice President Corporate R&D, AT&S

          Title TBD
          Jörg Doblaski, CTO, X-Fab

          		 MOA 3
          05:10 pm –
          06:00 pm

          Day 1 – Panel: Problem-Statement Discussion (50’)

          Panelists: Speaker of Day 1 and Guest: Elisabeth Steimetz (Director EPoSS)
          Moderated by: Steffen Kröhnert & Devan Iyer

           

          		  
          06:00 pm –
          07:00 pm          		 Free time, Transfer to Dinner Location  
          06:30 pm Pick-up at the Mercure Hotel MOA Berlin  
          07:00 pm –
          10:00 pm          		 Social Event – Networking Dinner Surprise Location
          10:00 pm Pick-up at the Event Location  

          DAY 2 – Thursday, July 3rd, 2025

          “Solution-Proposals-Day”

          Time

          Topic

          Room

          07:30 am –
          08:30 am

          Morning Coffee and Snacks + Networking

          MOA 1-2
          FOYER 1. OG

          08:30 am –
          10:10 am

          WS-Part 3-1: Supply Chain and R&D Proposals

          “Welcome and Recap”
          Matt Kelly, CTO, VP Standards & Technology, IPC
          Devan Iyer, Chief Strategist, Advanced Packaging, IPC

          “Advanced Packaging Materials Innovation through Co-Creative Activities”
          Hidenori Abe, Executive Director / CTO for Semiconductor Materials, Resonac

          “Solder As Known Good Interconnect (KGI) in Heterogeneous Integration”
          Andy C Mackie, Principal Engineer – Advanced Materials, Indium

          Title TBD
          Stian Haugen, CTO, Kitron

          “From Semiconductors to Electronics: the Manufacturing Path from Wafers to Systems”
          Bradford Factor, Senior Technologist, ASE/USI Europe

          “Integration Challenges for Automotive and Industrial Applications from Neways Perspective”
          Oliver Maiwald, Global Sales Director Microelectronics, Neways Advanced Microsystems

          “Robust Chiplet Solutions for the Automotive and Industrial Sectors“
          Martin Haug, Global Head of Semiconductors, Würth Elektronik eiSos GmbH & Co. KG

          MOA 3

          10:10 am –
          10:40 am

          Coffee Break + Networking

          MOA
          FOYER 1. OG

          10:40 am –
          11:25 am

          WS-Part 3-2: Supply Chain and R&D Proposals

          “The APECS Pilot Line as a new way of working with the FMD“
          Michael Töpper, Senior Expert for Technologies and Cooperation, FMD

          Title TBD
          Andy Heinig, Head of Department Efficient Electronics, Fraunhofer Institute of Integrated Circuits (IIS)

          “Chiplet Packaging for Automotive“
          Tanja Braun, Head of Department, Group Manager Assembly and Encapsulation, Fraunhofer Institute for Reliability and Microintegration (IZM)

          MOA 3

          11:25 am –
          11:55 am

          Day 2 – Panel: Solution-Proposals Discussion

          Panelists: Speaker of Day 2
          Moderated by: Steffen Kröhnert & Devan Iyer

           

          11:55 am –
          12:00 pm

          Wrap-up and Next Steps

           

          12:00 pm –
          01:00 pm

          Standing Lunch Break + Networking

          MOA 1-2

          Media- and Event Partners

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